Description: Electromigration in ULSI Interconnections, Hardcover by Tan, Cher Ming, ISBN 9814273325, ISBN-13 9789814273329, Like New Used, Free shipping in the US Tan (electrical engineering, Nanyang Technological U., Singapore) synthesizes the vast literature on electromigration across interconnections in an integrated circuit. The succinct reference could help back-end process engineers understand the key process parameters in order to ensure good interconnect electromigration performance, and help circuit designers know how their layout could affect the electromigration performance. He covers both aluminum and copper. A final chapter identifies questions still to be answered. Annotation ©2012 Book News, Inc., Portland, OR ()
Price: 125.46 USD
Location: Jessup, Maryland
End Time: 2025-02-01T12:07:32.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 14 Days
Refund will be given as: Money Back
Return policy details:
Publisher: World Industries Scientific Publishing Co Pte LTD
Book Title: Electromigration in Ulsi Interconnections
Topic: Electronics / Semiconductors, Electronics / Microelectronics, Electronics / Circuits / Vlsi & Ulsi, Electronics / Circuits / Integrated, Physics / General
Publication Year: 2010
Number of Pages: 450 Pages
Language: English
Genre: Technology & Engineering, Science
Item Weight: 0 Oz
Author: Cher Ming Tan
Format: Hardcover
