IC Development Kit: 11 IC Prototype Boards for Electronics Prototyping

Description: Overview: Elevate your electronics development with our versatile IC Development Kit, featuring 11 meticulously designed prototype (market) boards. Catering to a wide array of IC packages including UFQFPN28, UFQFPN32, VFQFPN36, UFQFPN48, LQFP48, TQFP64, VFQFPN68, SSOP (0.65 pitch, breadboard-adapted), and SOIC-D (16/1SC-70, breadboard-adapted), this kit is engineered to support your innovative projects from concept through to testing. Benefits: User-Friendly Design: With clear labeling, easy-to-access ports, and a straightforward interface, each board is built to facilitate an intuitive development experience, regardless of your skill level. Accelerate Your Projects: Save time with a ready-to-use solution that simplifies the prototyping process, allowing you to focus on innovation and design. Enhance Your Learning: Whether you're a student or a professional looking to expand your skill set, our kit offers a hands-on approach to understanding and applying electronic principles. Versatility: From IoT devices to consumer electronics prototypes, the possibilities are endless, providing you with the flexibility to explore various fields and applications. Ideal for: Electronics Engineering Students DIY Electronics Hobbyists Professional Engineers and Designers Tech Educators and Tutors Specifications: All boards are 2-layer with full pins enumeration UFQFPN28 - 1 pc; Dim: 33x33 mm; 2 through-hole pads for each pin; 4 through-hole pads for ground and 4 for power delivery isolated from IC, corresponding for top and bottom copper layers; Pinch: 0.5mm UFQFPN32 - 1 pc; Dim: 36x36 mm; 2 through-hole pads for each pin 4 through-hole pads for ground and 4 for power delivery isolated from IC, corresponding for top and bottom copper layers; Ground IC pad connected to ground pins; Pinch: 0.5mm VFQFPN36 - 1 pc; Dim: 38x38 mm; 2 through-hole pads for each pin; 4 through-hole pads for ground and 4 for power delivery isolated from IC, corresponding for top and bottom copper layers; Ground IC pad connected to ground pins; Pinch: 0.5 mm UFQFPN48 - 1 pc; Dim: 48x48 mm; 2 through-hole pads for each pin; 4 through-hole pads for ground and 4 for power delivery isolated from IC, corresponding for top and bottom copper layers; Ground IC pad connected to ground pins; Pinch: 0.5 mm LQFP48 - 1 pc; Dim: 46x46 mm; 2 through-hole pads for each pin; 4 through-hole pads for ground and 4 for power delivery isolated from IC, corresponding for top and bottom copper layers; Pinch: 0.5 mm TQFP64 - 1 pc; Dim: 51x51 mm; 2 through-hole pads for each pin; 4 through-hole pads for ground and 4 for power delivery isolated from IC, corresponding for top and bottom copper layers; Pinch: 0.5mm VFQFPN68 - 1 pc; Dim: 51x51 mm; 2 through-hole pads for each pin; 4 through-hole pads for ground and 4 for power delivery isolated from IC, corresponding for top and bottom copper layers; Ground IC pad connected to ground pins; Pinch: 0.4 mm SSOP (Bread board adapted) - 2 pc Dim: 16x31 mm; Bread Board Compatible; Power Layers; 24 pins; Pinch: 0.65 SOIC-D - 16/1sc-70 (Bread board adapted) - 2pc Dim: 16x21 mm; Bread Board Compatible; 16 pins; Pinch: 1.27

Price: 24.99 USD

Location: Santa Paula, California

End Time: 2024-12-10T06:43:04.000Z

Shipping Cost: 0 USD