LCP for Microwave Packages and Modules by Anh-Vu H. Pham (English) Hardcover Boo

Description: LCP for Microwave Packages and Modules by Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara Estimated delivery 3-12 business days Format Hardcover Condition Brand New Description A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP) at package, component and system levels, providing a detailed look at everything you need to know to get up-to-speed on the subject, including successful design details, techniques and potential pitfalls. Publisher Description A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCPs inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. Youll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering. Author Biography Anh-Vu H. Pham is a Professor at the University of California, Davis, where he leads the Microwave Microsystems Lab. He has published around 100 peer-reviewed papers, several book chapters and one book, is currently the Vice Chair of IEEE International Microwave Symposium Technical Committee on Power Amplifiers and Integrated Devices and a Microwave Distinguished Lecturer of the IEEE MTT for the term 2010–2012. Morgan J. Chen is a Staff Engineer at FutureWei Technologies, an R&D US subsidiary of Huawei Technologies. He has worked in both academia and industry for over a decade, advancing high-frequency packaging from DC to past 60 GHz. Kunia Aihara is an Electronics Engineer in the RF/EO Subsystems branch of the Air Force Research Laboratory. Details ISBN 1107003784 ISBN-13 9781107003781 Title LCP for Microwave Packages and Modules Author Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara Format Hardcover Year 2012 Pages 266 Publisher Cambridge University Press GE_Item_ID:149583741; About Us Grand Eagle Retail is the ideal place for all your shopping needs! With fast shipping, low prices, friendly service and over 1,000,000 in stock items - you're bound to find what you want, at a price you'll love! Shipping & Delivery Times Shipping is FREE to any address in USA. Please view eBay estimated delivery times at the top of the listing. Deliveries are made by either USPS or Courier. We are unable to deliver faster than stated. International deliveries will take 1-6 weeks. NOTE: We are unable to offer combined shipping for multiple items purchased. This is because our items are shipped from different locations. Returns If you wish to return an item, please consult our Returns Policy as below: Please contact Customer Services and request "Return Authorisation" before you send your item back to us. Unauthorised returns will not be accepted. Returns must be postmarked within 4 business days of authorisation and must be in resellable condition. Returns are shipped at the customer's risk. We cannot take responsibility for items which are lost or damaged in transit. For purchases where a shipping charge was paid, there will be no refund of the original shipping charge. Additional Questions If you have any questions please feel free to Contact Us. Categories Baby Books Electronics Fashion Games Health & Beauty Home, Garden & Pets Movies Music Sports & Outdoors Toys

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