Description: VLSI-SoC: New Technology Enabler Please note: this item is printed on demand and will take extra time before it can be dispatched to you (up to 20 working days). 27th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2019, Cusco, Peru, October 6-9, 2019, Revised and Extended Selected Papers Author(s): Carolina Metzler, Pierre-Emmanuel Gaillardon, Giovanni De Micheli, Carlos Silva-Cardenas, Ricardo Reis Format: Hardback Publisher: Springer Nature Switzerland AG, Switzerland Imprint: Springer Nature Switzerland AG ISBN-13: 9783030532727, 978-3030532727 Synopsis This book contains extended and revised versions of the best papers presented at the 27th IFIP WG [url] International Conference on Very Large Scale Integration, VLSI-SoC 2019, held in Cusco, Peru, in October 2019. The 15 full papers included in this volume were carefully reviewed and selected from the 28 papers (out of 82 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.
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Location: Aldershot
End Time: 2024-12-08T09:13:00.000Z
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Book Title: VLSI-SoC: New Technology Enabler
Number of Pages: 345 Pages
Language: English
Publication Name: VLSI-SoC: New Technology Enabler: 27th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2019, Cusco, Peru, October 6-9, 2019, Revised and Extended Selected Papers
Publisher: Springer Nature Switzerland A&G
Publication Year: 2020
Subject: Computer Science
Item Height: 235 mm
Item Weight: 711 g
Type: Textbook
Author: Ricardo Reis, Pierre-Emmanuel Gaillardon, Carolina Metzler, Carlos Silva-Cardenas, Giovanni De Micheli
Series: Ifip Advances in Information and Communication Technology
Item Width: 155 mm
Format: Hardcover